The TMP® interface is comparable in size to the SMA connector, and hence offers similar power handling capability and durability albeit in a push-on configuration. As such, it is ideal for design in radar, missile and satellite systems, as well as, commercial applications.
The design of the push-on interface enables use in microwave modules and dense packages, and facilitates rapid assembly and testing. The durable construction and ability to tolerate radial and axial misalignment allows for multiple engagement/disengagement cycles without degradation in electrical performance.
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