The sub-miniature, lightweight blindmateable interconnect solution is ideal for complex high performance microwave modules and systems where weight is the primary issue. Thus, it makes a perfect solution for military radios, radars, space, and test applications.
The design of the push-on interface enables use in microwave modules and dense packages, and facilitates rapid assembly and testing. The available bullet sizes allow for a PCB stackable height of <0.120”. The ability to tolerate radial and axial misalignment allows for multiple engagement/disengagement cycles without degradation in electrical performance.
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