常用規格
5 鍍錫層成份：Sn62%/Pb36%/Ag2%、Sn60%/Pb40%
、Sn96.5%/Ag3%/Cu0.5%、Sn96.5%/Ag3.5%，或
接受客製化。
5 單層鍍錫厚度：10~40μm(±5μm)
5 銅基材：無氧銅，銅含量≧99.96%；導電率≧99%@20°C
5 拉力強度：≧190N/ mm² (或根據客戶需求)
5 降伏強度：≦80N/ mm² (或根據客戶需求)
5 伸長率：≧30% (或根據客戶需求 )
5 電阻係數：≦0.02200Ω‧mm²/m @20°C
5 側邊彎曲度：每米長度自中心處測量不超過3mm
Typical Specification
5 Solder Alloys：Sn62%/Pb36%/Ag2%, Sn60%/Pb40%,
Sn96.5%/Ag3%/Cu0.5%, Sn96.5%/Ag3.5%, or by request.
5 Coating thickness of single layer：10~40μm(±5μm)
5 Copper material：OFC, copper content ≧99.96% ;
Conductivity ≧99%@20°C
5 Tensile strength：≧190N/ mm² (or by request)
5 Yield Strength：≦80N/ mm² (or by request)
5 Elongation：≧30% (or by request)
5 Resistivity：≦0.02200Ω‧mm²/m @20°C
5 Camber：≦3 mm in 1M length as measured from the
centerline of the wire.